Nano Insulation Board

The nano insulation board is formed by adopting light inorganic nanoSiO2 with an extremely low heat conductivity coefficient and ceramic fiber as raw materials, using aluminum foil with higher reflectivity as the bottom layer material, and adopting a single-layer composite structure through a continuous coating, composite, pressing, and baking process. The heat conductivity coefficient of the nano insulation board is smaller than that of static air, and the insulation performance of the nano insulation board is roughly four to six times better than that of a traditional heat insulation material. Thus far, it is the best material for thermal insulation.

Production Application

Thinning the thermal insulation layer can greatly reduce the thickness of the thermal layer, allowing for the miniaturization of the insulation device, increasing its volume, and decreasing heat storage.

Diminish the heat storage of the insulation layer: significantly shorten the heating-up time of the furnace. This will not only save energy but also improve productivity and facilitate simple temperature control.

Diminish heat dissipation: By using a thinner nano-micropore insulation material, it is possible to reduce both heat loss and the surface area of heat dissipation, thereby achieving the desired heat-insulation effect and significantly reducing heat loss. The surface temperature of the furnace can thus be lowered, improving the working environment.

The effect of temperature uniformity on reducing heat loss: It can achieve maximum temperature uniformity. The result is possible to improve product quality by improving the temperature uniformity of the metal solution, glass solution, and heat treatment products in the furnace.